Processing information acquisition system in processing machine supplying processing point with energy or material

ABSTRACT

A processing information acquisition system in a processing machine which feeds a processing point energy or material, the processing information acquisition system provided with a position information acquisition unit which acquires position information of a feed unit of energy or material, a feed rate control unit which receives a feed condition command of energy or material, converts the feed condition command to a control command which controls a feed of energy or material, and uses the converted control command to control a feed rate of energy or material from the feed unit, a feed rate estimation unit which acquires the control command from the feed rate control unit and calculates an estimated feed rate of energy or material which is fed to a processing point based on the control command, and an output unit which outputs the position information which the position information acquisition unit acquired and the estimated feed rate which the feed rate estimation unit calculated when the feed unit is located at a position corresponding to the position information.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a processing information acquisitionsystem in a processing machine which supplies a processing point withenergy or material.

2. Description of the Related Art

In a laser cutting machine, a laser welding machine, a laser heattreatment machine, a plasma cutting machine, an arc welding machine, awirecut machine, a sealant coating machine, an automatic paintingmachine, and various other types of processing machines, processing isperformed by firing a laser beam, generating an arc, or applying asealant, that is, supplying a processing point with energy or material,while moving the processing point over the workpiece. Further, at thetime of processing, along with this, sometimes a shield gas or weldingwire is supplied.

In such a processing machine, the position of the processing point isfeedback controlled by a servo control system based on positioninformation obtained from a pulse coder, linear scale, etc. of a servomotor performing positioning.

Further, regarding the supply of the laser beam, sealant, or otherenergy or material, the optimal feed rate and other processingconditions change depending on the processing speed and the shape to beprocessed, so the command values of the processing conditions which aretransmitted to the control device also have to be changed accordingly.For example, in firing a laser beam, feeding welding wire, and applyinga sealant, the amount of power of the laser excitation power supply, thefeed rate at the wire reel part, the sealant feed valve opening degree,or other processing conditions are changed.

Regarding this, after the command values of the processing conditionsare transmitted to the control device, the actual processing state atthe processing point does not immediately change to the desiredprocessing conditions. For example, in a laser processing machine, acertain time is required from when current is supplied to the lasergenerator to when the laser beam is fired. In this way, there is somedelay in the response. Furthermore, the average laser output value ofthe actually fired laser beam is not proportional to the command value.Further, in another example, when feeding a gas or liquid to aprocessing point, the command value relating to the valve opening degreeand the amount which is actually fed to the processing point are alsonot strictly proportional.

In these various types of processing machines, outputting processinginformation relating to the actual processing state at a processingpoint, including position information of the processing point, in realtime simultaneously to a liquid crystal panel or other display device orto a hard disk drive or other storage device would be extremelyeffective in monitoring, development, troubleshooting, etc. However, forgeneration of laser beams or arcs and feed of sealant, instead offeedback control, open loop control is sometimes used. Therefore,acquiring processing information and outputting that processinginformation in real time is difficult.

Japanese Patent Publication (A) No. 2001-75622 (JP2001-75622A) disclosesa servo system which is provided with a servo control device including adrive unit which drives a controlled object and with a plurality ofservo compensation units and which is provided with a display devicewhich displays control conditions of a controlled object. The servosystem of 2001-75622A enables simultaneous confirmation of the effect ofservo compensation processing and the legitimacy of an operation andenables quick and easy determination of the servo compensationparameters of the positioning control. Further, Japanese PatentPublication (A) No. 7-204942 (JP7-204942A) discloses a monitoring systemof an electrodischarge machine which can monitor the state of change ofa monitored value showing the processing state of the electrodischargemachine. Further, Japanese Patent Publication (A) No. 7-5908 (7-5908A)discloses a measuring and monitoring system which acquires signals to bemeasured from the system being measured, samples them at fixed timeintervals, and measures and monitors them by arithmetic processing andthereby measures and monitors the position, speed, and other analog anddigital signals of machine operation. Further, Japanese PatentPublication (A) No. 7-294558 (JP7-294558A) discloses a method ofcorrection of data timing of a waveform recording and display systemwhich automatically corrects time deviations due to differences insignal transmission paths of analog input waveforms and logic inputwaveforms in accordance with the sampling speed.

However, the devices described in JP2001-75622A, JP7-204942A, JP7-5908A,and JP7-294558A are ones which output a measured value to a displaydevice or storage device. They are not ones which can estimateprocessing information relating to the actual processing state at aprocessing point and output it in real time to a display device orstorage device. To output processing information relating to the actualprocessing state at a processing point in real time, some sort ofestimation has to be performed to calculate the values.

SUMMARY OF INVENTION

The present invention provides, in one aspect, a processing informationacquisition system in a processing machine which supplies a processingpoint with energy or material, which system estimates and outputsprocessing information relating to an actual processing state at aprocessing point, including position information of the processingpoint.

The present invention, as one aspect, provides a processing informationacquisition system in a processing machine which supplies a processingpoint with energy or material, which system is provided with a positioninformation acquisition unit which acquires position information of afeed unit of energy or material, a feed rate control unit which receivesa feed condition command of energy or material, converts the feedcondition command to a control command which controls a feed of energyor material, and uses the converted control command to control a feedrate of energy or material from the feed unit, a feed rate estimationunit which acquires the control command from the feed rate control unitand calculates an estimated feed rate of energy or material which is fedto a processing point based on the control command, and an output unitwhich outputs the position information which the position informationacquisition unit acquired and the estimated feed rate which the feedrate estimation unit calculated when the feed unit is located at aposition corresponding to the position information.

BRIEF DESCRIPTION OF DRAWINGS

The objects, features, and advantages of the present invention willbecome clearer from the following explanation of the embodiments withreference to the attached drawings, in which

FIG. 1 is a block diagram showing an outline of a processing informationacquisition system according to one aspect of the present invention,

FIG. 2 is a view showing the specific configuration of a laserprocessing machine including a processing information acquisition systemaccording to one aspect of the present invention,

FIG. 3 is a view showing the relationship between a current commandvalue and a peak output according to one aspect of the presentinvention,

FIG. 4 is a view showing the relationship among a pulse frequency, aduty ratio, and an average laser output according to one aspect of thepresent invention,

FIG. 5 is a view showing a path of laser processing according to oneaspect of the present invention using a specific example,

FIG. 6 is a view showing processing performed at the time of laserprocessing along the path shown in FIG. 5 using specific numericalvalues,

FIG. 7 is a view showing an example of display of processing informationobtained by processing along the path shown in FIG. 5,

FIG. 8 is a view showing a path of laser processing according to oneaspect of the present invention using another specific example,

FIG. 9 is a view showing an example of display of processing informationobtained by processing along the path shown in FIG. 8,

FIG. 10 is a view showing a flowchart of feed rate estimation processingaccording to one aspect of the present invention, and

FIG. 11 is a view showing the specific configuration of a processinginformation acquisition system according to another aspect of theinvention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Below, embodiments of the present invention will be explained in detailwhile referring to the drawings.

FIG. 1 is a block diagram showing an outline of a processing informationacquisition system 1 according to one aspect of the present invention.The processing information acquisition system 1 according to one aspectof the present invention is included in a part of a processing machine 2which supplies a processing point with energy or material.

The processing machine 2 is, for example, provided with parts which areconnected with each other by a bidirectional bus such as a CPU (centralprocessing unit), a ROM (read only memory) and a RAM (random accessmemory). Further, the processing machine 2 may be further provided witha nonvolatile memory. Furthermore, the processing machine 2 has a feedunit 3 which feeds a processing point with energy or material, forexample, on a workpiece and a feed position control unit 4 forcontrolling the relative position of the feed unit 3 with respect to theprocessing point.

The processing information acquisition system 1 according to one aspectof the present invention has a position information acquisition unit 5which acquires position information of the feed unit 3 which iscontrolled by the feed position control unit 4 and a feed rate controlunit 6 which receives a processing condition command relating to feed,which is directly input from the outside using a keyboard, mouse, etc.or is generated by a program etc. such as the amount of power of a laserexcitation power supply, feed rate at a wire reel part, or openingdegree of a sealant feed valve, converts this feed condition command toa control command which controls a feed of energy or material, and usesthe converted control command to control a feed rate of energy ormaterial from the feed unit. Furthermore, the processing informationacquisition system 1 according to one aspect of the present inventionhas a feed rate estimation unit 7 which acquires a control command fromthe feed rate control unit 6 and uses this control command as the basisto calculate an estimated feed rate of energy or material which isestimated to be actually fed to a processing point, and an output unit 8which outputs position information which the position informationacquisition unit acquired and the estimated feed rate which the feedrate estimation unit calculated when the feed unit is located at aposition corresponding to this position information to a display unitwhich visually displays this to an operator, a hard disk drive or otherstorage unit which stores the estimated feed rate, or an output deviceto a printer or other medium.

Further, the processing information acquisition system 1 according toone aspect of the present invention may further have a feed ratemeasurement unit 9 which finds in advance a relationship between acontrol command and an estimated feed rate of energy or material, forexample, a calculation formula, parameter, or map. For the feed ratemeasurement unit 9 to find the relationship between a control commandand an estimated feed rate of energy or material, experiments are runwhile changing the processing point from a workpiece to the feed ratemeasurement unit 9 and changing the processing conditions. By using thefeed rate measurement unit 9 to find the relationship between a controlcommand and an estimated feed rate of energy or material in advance, thefeed rate estimation unit 7 can use the acquired control command andpreviously found relationship to precisely calculate the estimated feedrate. Note that, the calculation formula, parameter, or map is stored ina ROM or other storage device.

The energy or material which is fed from the feed unit 3 is, forexample, one or more types of energy or material selected from a lightwave, current, plasma stream, gas, liquid, solid, powder, and atomizedfluid. Specifically, a processing machine 2 including a processinginformation acquisition system 1 according to one aspect of the presentinvention may be a laser cutting machine, a laser welding machine, alaser heat treatment machine, a plasma cutting machine, an arc weldingmachine, a wirecut machine, a sealant coating machine, an automaticpainting machine, etc. Therefore, when the processing machine 2 is alaser processing machine, the fed energy or material is a laser beam orassist gas, when the processing machine 2 is a plasma, processingmachine, the fed energy or material is an arc current or plasmagenerating current or gas or welding filler, and when the processingmachine 2 is a solvent coating processing machine, the fed energy ormaterial is a paint, adhesive, or sealant.

Next, while referring to FIG. 2, using the case where the processingmachine 2 is a laser processing machine 10 as an example, the specificconfiguration of a laser processing machine 10 including a processinginformation acquisition system 11 according to one aspect of the presentinvention will be explained. The laser processing machine 10 has anumerical control device 12 (CNC). The numerical control device 12includes an input device which receives as input the laser outputconditions or various data, for example, a keyboard, mouse, etc.

The numerical control device 12 reads an NC program 13 which is storedin a ROM, RAM, not shown storage device, etc., deciphers the axialmovement commands, including information which determines the positionof the processing point, in the NC program 13 at an NC programdeciphering unit 14, and generates movement commands, includinginformation of amounts of movement of the different axial directions,from the deciphered axial movement commands at a movement commandgeneration unit 15. Furthermore, the generated movement commands aresorted by a sorting unit 16 to X-axial and Y-axial direction movementcommands and Z-axial direction movement commands. These are sent througha synchronization interface 34 to a servo control device 17 whichcontrols the drive in the X-axial and Y-axial directions for a not shownmovable table which holds a workpiece and a servo control device 18which controls the drive in the Z-axial direction for a processingnozzle.

The servo control devices 17 and 18 control corresponding servo powersupplies 19 and 20 in accordance with the movement commands to drive theservo motors 21 and 22 and, as a result, make the movable table move inthe X-axial direction or Y-axial direction and, further, make theprocessing nozzle move in the Z-axial direction. The actual amounts ofmovement of the movable table and the processing nozzle are detected bycorresponding pulse coders 23 and 24. These amounts of movement are fedback to the servo control devices 17 and 18. The servo control devices17 and 18 compare and process the values of movement commands, which aregenerated from the deciphered axial movement commands and are sent tothe servo power supplies 19 and 20, and the actual amounts of movement,which are detected by the pulse coders 23 and 24, at the feedbackcircuit and send movement commands of the differences to the servo powersupplies 19 and 20 in accordance with the errors for performing feedbackcontrol.

Further, a gap sensor 25 which detects a gap between a workpiece 30which is held at the movable table and the processing nozzle by acontact piece is attached to the processing nozzle. The path oftransmission of the feedback signal can be switched with the pulse coder24. Note that, instead of the gap sensor 25 using a contact, it is alsopossible to use an electrostatic capacity type gap sensor.

Further, the numerical control device 12 deciphers a laser outputcommand including the laser output and pulse frequency, the duty ratio,and other information of the laser beam in the NC program 13 at the NCprogram deciphering unit 14, generates a laser output informationcommand at the laser output information command generation unit 26, andsends this through the synchronization interface 34 to the laser controldevice 27. In the laser control device 27, in accordance with the laseroutput information command, a current command value which the laserpower supply 28 should output is calculated and is commanded to thelaser power supply 28. The laser power supply 28 feeds the excitationcurrent of the commanded current command value to the laser generator29. As a result, the laser generator 29 generates a laser beam. Thegenerated laser beam is focused by a not shown focusing lens and isfired at the workpiece 30 to perform laser processing.

However, as explained above, the amount of movement obtained by a pulsecoder can be collected in substantially real time, but for the laseroutput, the current command value which is commanded by the laser powersupply 28 and the average laser output of the actually generated laserbeam are not proportional. Further, the laser processing machine 10shown in FIG. 2 is provided with a power monitor 31 for monitoring thelaser output for comparison with a later explained estimated value ofthe laser output. However, such a power monitor 31 measures the heatflux due to the laser, so the time constant is around 1 second, that is,the response is slow. For this reason, real time collection of theaverage laser output is difficult.

Explaining this using an example, the time constant of the power monitor31 is around 1 second, while the feed rate of the laser processing, inthe case of high speed processing, sometimes reaches 30 m/min. Even ingeneral processing, the feed rate is about 9 m/min. Consider the case ofchanging the laser output or other processing conditions at a certainpoint on the path when performing laser processing by a feed rate of 9m/min. The laser output itself is electricity converted to light, so theoutput is switched within 1 ms in accordance with a change of theprocessing conditions. At this time, the speed of the processing pointscanning over the workpiece 30 is 150 mm/s, so after 1 second afterchanging the processing conditions when the value of the power monitor31 indicates the actual value, the processing point moves as much as 150mm. By collecting and displaying the position information of theprocessing nozzle and the value of the power monitor 31 with this, itwould be difficult for the operator to obtain a grasp of the processingstate actually occurring at the processing point. There are also closeto real time, high speed, accurate high speed power measuring devices,but these are expensive and the measuring devices themselves are largein size.

Furthermore, usually, an operator prepares an NC program for apulse-like laser output with a designated peak output, pulse frequency,and duty ratio while considering the average laser output. Further, theexcitation current which is commanded from the laser power supply 28 tothe laser generator 29 is a pulse waveform. It is difficult to calculatethe pulse frequency and the duty ratio in reverse from analog data.

Therefore, in feed rate estimation calculation units 32 and 33, theaverage laser output, that is, the average of the laser output which isactually fed from the processing nozzle to the workpiece, is estimatedand is collected through the synchronization interface 34 at aprocessing information collection unit 35. Simultaneously with this,that is, feedback controlled position information at the time of firingthe laser is collected through the synchronization interface 34 at theprocessing information collection unit 35. Finally, the processinginformation which was collected by the processing information collectionunit 35 is displayed by a processing information display unit 36.

Next, the estimation processing of the average laser output according toone aspect of the present invention performed in the feed rateestimation calculation units 32 and 33 will be explained. FIG. 3 is aview showing the relationship between a current command value Ic fromthe laser power supply 28 to the laser generator 29 and the peak outputPc according to one aspect of the present invention. The abscissaindicates the current command value Ic, while the ordinate indicates thepeak output Pc. Further, FIG. 4 is a view showing the relationship amonga pulse frequency Fr, duty ratio Duty, and average laser output Pasaccording to one aspect of the present invention. The abscissa indicatesthe pulse frequency Fr, while the ordinate indicates the average laseroutput Pas. That is, the average laser output does not necessarily matchthe product of the peak output Pc and the duty ratio Duty due tocharacteristics of the laser generator 29 etc. The average laser outputPas is calculated by interpolation between the pulse frequency Fr andthe duty ratio Duty from the relationship shown in FIG. 4. The averagelaser output Pas at the time of the duty ratio Duty=100% matches thepeak output Pc. These relationships shown in FIGS. 3 and 4 are found inadvance by experiments or by calculations using the above-mentioned feedrate measurement unit 9, for example, high speed power measuring device37 (see FIG. 2), and are stored in a ROM etc.

FIG. 5 is a view showing a path of laser processing according to oneaspect of the present invention using a specific example, while FIG. 6is a view showing processing performed at the time of laser processingalong the path shown in FIG. 5 using specific numerical values. The pathshown in FIG. 5 is a straight line comprised of the sections M and N.The processing nozzle moves by the same speed and vector from thesection M to the section N. At the sections M and N, the processingconditions of the laser output differ.

Referring to FIG. 6, the flow of command values becomes as follows: Thenumerical control device 12 deciphers the NC program 13 and, every fixedperiod, in FIG. 6, every 16 ms, generates a laser output informationcommand and axial movement commands (A). The laser output informationcommand is comprised of a set of a peak output Pc=500 W, pulse frequencyFr=1000 Hz, and duty ratio Duty=100% (section M) and a set of a peakoutput Pc=1000 W, pulse frequency Fr=2000 Hz, and duty ratio Duty=75%(section N). Further, the axial movement commands are the same in speedof movement, so are comprised of X-axial direction=1.073 and Y-axialdirection=2.147, that is, fixed values. Further, Tc shows the timing ofswitching of the processing conditions. At the fifth command from thetop, after 10/16/16 ms, that is, after 10 ms, the processing conditionsare switched. Note that, for simplification of the explanation, thevalue of the Z-axial direction axial movement command is made 0.

Furthermore, the laser output information command is sent through thesynchronization interface 34 to the laser control device 27, while theaxial movement commands are sent through the sorting unit 16 andsynchronization interface 34 to the servo control devices 17 (B). Atthis time, the laser output information command, which is comprised ofthe peak output Pc, pulse frequency Fr, and duty ratio Duty, isconverted to the current command value Ic of the discharge current tothe laser power supply 28, pulse-on time Ton, and pulse-off time Toffand then transmitted. The conversion from the peak output Pc=1000 W tothe current command value Ic=7V is performed based on the relationshipshown in FIG. 3. Further, the pulse-on time Ton and the pulse-off timeToff are found by finding the period from the pulse frequency Fr andconsidering with duty ratio with this. That is, if focusing on the fifthcommand from the top, since the pulse frequency Fr is 2000 Hz, theperiod becomes 0.5 ms. As opposed to this, if considering the fact thatthe duty ratio Duty is 75%, the pulse-on time Ton=0.375 ms and pulse-offtime Toff=0.125 ms. Here, since this is digital calculation, the thirddecimal place on down are discarded and the result becomes the pulse-ontime Ton=0.37 ms and pulse-off time Toff=0.12 ms.

Note that, the axial movement commands remain the X-axialdirection=1.073 and Y-axial direction=2.147.

The 16 ms interval laser output information command and axial movementcommands are converted at the laser control device 27 and servo controldevices 17 to even shorter period, in FIG. 6, 1 ms interval laser outputinformation command and axial movement commands (C). Further, theselaser output information command and axial movement commands are sent tothe laser power supply 28 and laser generator 29 and to the servo powersupply 19 and servo motor 21 whereby a laser beam is fired and themovable table is moved. At the laser power supply 28, the commandedcurrent command value Ic is run by a built-in counter circuit forexample for the pulse-on time Ton and the feed of current is stopped forexactly the pulse-off time Toff. By repeating this, a pulse output isrealized.

Note that, the axial movement commands, if converted to 1 ms intervals,become X-axial direction=0.067 and Y-axial direction=0.134.

After this, regarding the amount of axial movement, a feedback signalfrom a pulse coder 23 which is mechanically coupled and rotates with theservo motor 21 is collected as the actual amount of axial movement bythe processing information collection unit 35 (D). The amount of axialmovement of this collected feedback signal is the same as that used forfeedback control in the servo control device. Further, as referenceinformation, the power monitor value Pa=500 W monitored by the powermonitor 31 is similarly collected by the processing informationcollection unit 35. However, as explained above, this power monitorvalue Pa does not accurately express the laser output. Note that, beforethese values are collected by the processing information collection unit35, the later explained delay processing is performed.

On the other hand, regarding laser output, the processing informationcollection unit 35 collects results of estimation calculation from thelaser output information command transmitted from the laser controldevice 27 to the laser power supply 28. That is, in the feed rateestimation calculation units 32 and 33, conversion processing reverse tothe above-mentioned processing is performed.

First, the estimated peak output Pcs=1000V is calculated from thecurrent command value Ic=7V of the discharge current to the laser powersupply based on FIG. 3. This estimated value just happens to match theoriginal peak output Pc=1000 W, that is, the immediately succeedingvalue deciphered from the NC program 13, but these conversions orcalculations are performed by digital calculations, so error sometimesoccurs. If converting from the pulse-on time Ton and pulse-off time Toffto the pulse frequency Fr and duty ratio Duty, estimated pulse frequencyFrs=2041 Hz and estimated duty ratio Dutys=75.5%. In the original laseroutput information command, pulse frequency Fr=2000 Hz and duty ratioDuty=75%, so error occurs. This error results since originally thepulse-on time Ton=0.375 ms and pulse-off time Toff=0.125 ms, but theseare made the pulse-on time Ton=0.37 ms and pulse-off time Toff=0.12 ms.Note that, the estimation up to here is performed by the feed rateestimation calculation unit 32 (E).

The feedback signal from the pulse coder and the estimated calculatedvalue of the laser output command are collected at this stage throughthe synchronization interface, so can be recorded for a certain periodin which the mutual timing between the position information of theprocessing nozzle and the laser output is guaranteed.

Next, the estimated peak output Pc, pulse frequency Fr, and duty ratioDuty are used to calculate by estimation the average laser output valuePas. This estimation calculation is performed by interpolationcalculation from the relationship shown in FIG. 4. That is, when theduty ratio Duty=100%, the average laser output becomes the same as thepeak output Pc-1000 W. Therefore, if using the previously foundestimated pulse frequency Frs=2041 Hz and estimated duty ratioDutys=75.5% as the basis for interpolation calculation from therelationship shown in FIG. 4, the average laser output Pas-805 W iscalculated (F). The estimation up to here is performed by the feed rateestimation calculation unit 33.

Finally, compared with when finding the actual amount of axial movement,it takes time for the estimation processing of the average laser outputto be performed, so to correct the time differences, delay processing isperformed for the data. The amount of correction is found in advance byexperiments etc.

As explained above, according to one aspect of the present invention, bycollecting the feedback signals from the pulse coders 23 and 24 andestimated values based on the values of the laser output informationcommand through the synchronization interface 34 by the processinginformation collection unit 35, it becomes possible to correct the axialmovement amounts and timing of the average laser output and display theresults on a processing information display unit 36 or output them to ahard disk drive or other storage device. Due to this, it is possible todisplay on a display device by what extent an actual path deviates fromthe intended path of the processing point, possible to display deviationbetween the intended laser output and the actual laser output, andpossible to output it to the storage device.

FIG. 7 is a view showing an example of display of processing informationobtained by processing along the path shown in FIG. 5. The abscissashows the time t. The average laser output Pas estimated for a positionX of the processing nozzle is shown. Further, by way of reference, thepower monitor value Pa and the measurement value Pr which is measured bya high speed power measuring device are also displayed. As a result, thepower monitor value Pa, despite being actually measured data, does notexpress the switching of the laser output well, while the average laseroutput Pas which is estimated by one aspect of the present inventionshows the same tendency as the measurement value Pr which is measured bythe high speed power measuring device and reproduces the switching ofthe actual laser output well, it is learned.

FIG. 8 is a view showing a path of laser processing according to oneaspect of the present invention using another specific example. The pathshown by FIG. 8 is accompanied with an acute angle corner part. Laserprocessing is heat processing, so at such an acute angle part,overheating occurs more easily and processing defects occur more easilythan with a straight path. Therefore, in the part of the section PQrising from the vertex P of the acute angle corner, the processingconditions are changed. From the point Q, where it is considered thestraight part has generally been returned to, the original processingconditions are returned to, whereby processing defects are prevented. Inthe section PQ, the processing speed is also kept low and the averagelaser output is kept down as much as possible to prevent heat input. Onthe other hand, a laser output passing through the workpiece isnecessary, so the technique is adopted of setting the peak output highand reducing the duty ratio by that amount so as to reduce the averagelaser output.

The speed at the vertex P and section PQ is slower compared with othersections, so around the section PQ, there is a deceleration oracceleration section. In this acceleration/deceleration section, thelaser output conditions are gradually changed in accordance with thespeed so as to prevent the amount of input heat per unit length frombecoming excessive.

The above estimation was performed considering the above. The resultsare displayed in the same way as in FIG. 7 for comparison of the variousvalues. FIG. 9 is a view showing an example of display of processinginformation obtained by processing along the path shown in FIG. 8. Theabscissa indicates the time t.

First, if taking note of the tangential speed, if approaching the vertexP, deceleration is started. At the corner rising section PQ, movement isperformed at a low speed. After this, after passing the point Q,acceleration is started and the usual tangential speed is returned to.

As opposed to this, the estimated peak output Pcs which is calculated inreverse from the current command value Ic of the discharge current tothe laser power supply based on the relationship shown in FIG. 3 is asomewhat higher value at only the section PQ compared with the othersections so as to maintain the force penetrating through the plate. Onthe other hand, the estimated duty ratio Dutys calculated in reversefrom the pulse-on time and off time becomes smaller along withdeceleration and, at the section PQ, is reduced to its minimum limit.Further, it increases along with acceleration and changes the output ofthe laser. Further, the changes in the average laser output Pas which iscalculated based on the estimated peak output Pcs, estimated pulsefrequency Frs, estimated duty ratio Dutys, and relationship shown inFIG. 4 are also shown in FIG. 9. On the other hand, it is shown that thepower monitor value Pa by the power monitor 31 is delayed from thebehavior of the actual laser output.

As clear from a comparison of the average laser output Pas and the powermonitor value Pa, according to the estimation processing of one aspectof the present invention, it becomes possible to calculate a valueaccurately reproducing the switching of the processing conditions andbecomes possible to reproduce processing information at a processingpoint which is difficult to observe.

In this regard, in the laser processing machine 10, to maintain aconstant height of a focusing point on the workpiece 30, the distancebetween the workpiece 30 and the processing nozzle is measured duringthe processing and feedback control in the Z-axial direction isperformed by the servo control device 18 in accordance with this height.This is because the workpieces 30 which are processed by laser aremostly plate shaped. The surfaces scanned by the focused point are notcompletely flat. Just a slight change in the distance between thefocused point and workpiece 30 has a serious effect on the processingresults. For this reason, in the example of display shown in FIG. 9, theZ-axial height is also displayed. According to one aspect of the presentinvention, it becomes possible to accurately estimate the average laseroutput in real time, so by simultaneously displaying this and theZ-axial height in real time, it becomes possible to learn the effects ofchange in the Z-axial height on the laser processing in real time.

FIG. 10 is a view showing a flowchart of feed rate estimation processingaccording to one aspect of the present invention explained using theabove laser processing machine 10 as an example. First, at step S1, theNC program is read. Next, at step S2, the NC program which was read atstep S1 is deciphered and the deciphered NC program is used as the basisto generate a laser output information command and axial movementcommands. Next, at step S3, the output information command and axialmovement commands generated at step S2 are sorted and sent. Next, atstep S4, the data is converted, that is, is converted to shorter periodcommands. Next, at step S5, based on the relationship shown in FIG. 3,reverse conversion processing of the data for calculating the estimatedpeak output Pcs etc. from the current command value Ic, that is, feedrate estimation calculation, is performed. Next, at step S6, feed rateestimation calculations are performed for calculating the average laseroutput Pas based on the relationship shown in FIG. 4. Next, at step S7,the timing of the position information and the average laser output iscorrected and the processing information is collected, while at step S8,the processing information is output, for example, is displayed on adisplay device.

FIG. 11 is a view showing the specific configuration of a processinginformation acquisition system according to another aspect of theinvention using an adhesive coater 100 which coats an adhesive at aperipheral edge of a workpiece as an example.

An adhesive is stored in a liquid storage tank 101 and is introduced bya gear pump 102 into a pressure container 103. The pressure container103 has a liquid level gauge 104 arranged in it. A liquid resupplycontrol device 105 which monitors the value of the liquid level gauge104 controls the gear pump 102 so as to operate the gear pump 102 toresupply adhesive in the pressure container 103 if the liquid levelfalls and to stop the gear pump 102 when the liquid level reaches apredetermined height. Compressed air 106 is introduced to the pressurecontainer 103 from the outside and 0.5 to 0.8 MPa of pressure isapplied. The pressure inside of the pressure container 103 is measuredby the pressure gauge 107.

The numerical control device (CNC) 108 controls the relative positionsof the workpiece 109 and the processing nozzle 110 by sending movementcommands to the servo control device 111 which controls the drive of anot shown movable table which holds the workpiece 109. The servo controldevice 111 controls the servo power supply 112 in accordance with themovement commands to drive the servo motor 113 and finally make themovable table move. The amount of actual movement of the movable tableis detected by the pulse coder 114 then the movement amount is fed backto the servo control device 111. The servo control devices 111 comparesthe values of the movement commands and the amount of actual movementdetected by the pulse coder 114 by the feedback circuit in the servocontrol device 111 and sends movement commands of the difference to theservo power supply 112 in accordance with the error for performingfeedback control.

Further, the numerical control device 108 sends a valve opening/closingcommand to a valve control device 115. The valve control device 115controls the opening and closing of a proportional valve 116 inaccordance with a valve opening/closing command and controls the feedrate of the adhesive to the workpiece 109. The proportional valve 116 isa valve with an opening degree which changes in accordance with acommand voltage included in the valve opening/closing command.Therefore, the proportional valve 116 is a valve in which the openingdegree is proportionally controlled and is not a valve in which thevalve opening area or the flow rate of the adhesive is proportionallycontrolled. Further, the flow rate of the adhesive changes by thepressure of the compressed air 106 as well. Further, the adhesive isfirst coated on the workpiece 109 after reaching the processing nozzle110 arranged at the end of the piping. Therefore, furthermore, anadhesive is high in viscosity, so there is a response delay from whenthe proportional valve 116 opens to when the adhesive reaches theworkpiece 109. There is also a response delay from when the proportionalvalve 116 becomes fully closed to when the feed of the adhesive ends.

Here, when the processing nozzle 110 moves with respect to the workpiece109 by a constant speed, it is preferable that the adhesive flow rate beconstant. However, at the time of acceleration when starting the coatingwork, at the time of acceleration and deceleration near the corner partwhen coating a corner part along a path such as shown in FIG. 8, or thetime of deceleration when ending the coating work, if not adjusting theflow rate in accordance with the speed, it is not possible to coat afixed amount of adhesive per unit length. In particular, when changingthe flow rate, it is necessary to also consider the response delay fromwhen changing the valve opening degree of the proportional valve 116 towhen the flow rate actually changes.

The operator endeavors to coat an adhesive well with no coating defectsby changing the operating conditions of the proportional valve 116 invarious ways and deciding on the conditions to set while viewing thestate of coating on the workpiece 109, but if it were possible to learnthe amount of the adhesive coated on the workpiece 109 during theprocessing, a striking improvement in the work efficiency could beexpected.

Therefore, in the embodiment shown in FIG. 11, a valve opening/closingcommand to the proportional valve 116 and the pressure value inside thepressure container 103 which is shown by the pressure gauge 107 are usedas the basis to calculate by estimation the actual feed rate of adhesivefrom the processing nozzle 110. By synchronizing, collecting, andoutputting the estimated adhesive feed rate and amount of axialmovement, that is, position information, the operator can easilyunderstand the relationship between the speed of the processing nozzle110 and adhesive feed rate.

Specifically, first, the cross-sectional area of the valve opening iscalculated by estimation from the command voltage to the proportionalvalve 116. The relationship between the command voltage and thecross-sectional area is found in advance by experiments etc. Byutilizing the relationship between the command voltage and thecross-sectional area and considering the pressure inside the pressurecontainer 103, it is possible to calculate the estimated flow rate atthe proportional valve 116. The flow rate at the processing nozzle 110has some response delay, so the flow rate when assumed as a primarydelay system with respect to changes in the flow rate at theproportional valve 116 is calculated by estimation as the flow rate atthe processing nozzle 110. The results are displayed together with theposition information and speed information from the pulse coder 114. Asa result, it becomes possible to accurately estimate the adhesive flowrate and becomes possible to easily set the processing conditions.

As explained above, in a first aspect of the present invention, there isprovided a processing information acquisition system in a processingmachine which supplies a processing point with energy or material, whichsystem is provided with a position information acquisition unit whichacquires position information of a feed unit of energy or material, afeed rate control unit which receives a feed condition command of energyor material, converts the feed condition command to a control commandwhich controls a feed of energy or material, and uses the convertedcontrol command to control a feed rate of energy or material from thefeed unit, a feed rate estimation unit which acquires the controlcommand from the feed rate control unit and calculates an estimated feedrate of energy or material which is fed to a processing point based onthe control command, and an output unit which outputs the positioninformation which the position information acquisition unit acquired andthe estimated feed rate which the feed rate estimation unit calculatedwhen the feed unit is located at a position corresponding to theposition information.

That is, in the first aspect of the present invention, the effect isexhibited that a processing machine which feeds a processing pointenergy or material can estimate and output processing informationrelating to the actual processing state at a processing point, includingposition information of the processing point. Further, the first aspectof the present invention can be utilized in various situations such asthe monitoring of the processing state, development stage, andtroubleshooting.

Further, in a second aspect of the present invention, there is provideda processing information acquisition system where the fed energy ormaterial is one or more types of energy or material selected from alight wave, current, plasma stream, gas, liquid, solid, powder, andatomized fluid.

That is, the second aspect of the present invention enables applicationto various types of processing machines.

Further, in a third aspect of the present invention, there is provided aprocessing information acquisition system where the feed rate estimationunit has related information, found in advance, between the controlcommand and the estimated feed rate of energy or material and calculatesthe estimated feed rate from the control command and the relatedinformation.

Further, in a fourth aspect of the present invention, there is provideda processing information acquisition system which is further providedwith a feed rate measurement unit which finds the related information inadvance.

Further, in a fifth aspect of the present invention, there is provided aprocessing information acquisition system where the related informationis a calculation formula or parameter or map.

That is, the third to fifth aspects of the present invention enablecalculation of the accurate estimated feed rate by having relatedinformation, found in advance, between the control command and theestimated feed rate of energy or material.

Further, in a sixth aspect of the present invention, there is provided aprocessing information acquisition system where the processing machineis a laser processing machine and where the fed energy or material is alaser beam or assist gas.

Further, in a seventh aspect of the present invention, there is provideda processing information acquisition system where the processing machineis a laser processing machine, the fed energy or material is a laserbeam or assist gas, the related information is comprised of firstrelated information prescribed in a peak output and a current commandvalue and a second related information prescribed by a peak output, apulse frequency, and a duty ratio, and the feed rate estimation unituses a current command value and the first related information toestimate a peak output and uses an estimated peak output, pulsefrequency, duty ratio, and the second related information to estimate anaverage laser output.

Further, in an eighth aspect of the present invention, there is provideda processing information acquisition system wherein the processingmachine is a plasma processing machine and where the fed energy ormaterial is an arc current, plasma generating current, gas, or weldingfiller.

Further, in a ninth aspect of the present invention, there is provided aprocessing information acquisition system where the processing machineis a solvent coating processing machine and where the fed energy ormaterial is a paint, adhesive, or sealant.

Further, in a 10th aspect of the present invention, there is provided aprocessing information acquisition system where the output unit outputsthe position information, which the position information acquisitionunit acquired, and the estimated feed rate, which the feed rateestimation unit calculated when the feed unit is at a positioncorresponding to the position information, to a display unit or storageunit.

That is, in the 10th aspect of the present invention of the presentinvention, the effect is exhibited that an operator can obtain a visualgrasp of the processing state through the display unit or monitoring bya monitoring system becomes easy by output to a storage unit.

In all of the aspects of the present invention, the common advantageouseffect is exhibited that a processing machine which feeds a processingpoint energy or material can estimate and output processing informationrelating to the actual processing state at a processing point, includingposition information of the processing point.

Above, the present invention was explained with reference to preferredembodiments, but a person skilled in the art would understand thatvarious corrections and changes could be made without departing from thescope of the following claims.

1. A processing information acquisition system in a processing machine which supplies a processing point with energy or material, the processing information acquisition system comprising: a processor; a position information acquisition unit which acquires position information of a feed unit of energy or material; a feed rate control unit which receives a feed condition command of energy or material, converts said feed condition command to a control command which controls a feed of energy or material, and uses the converted control command to control a feed rate of energy or material from said feed unit; a feed rate estimation unit which acquires said control command from said feed rate control unit and calculates an estimated feed rate of energy or material which is fed to a processing point based on said control command; and an output unit which outputs said position information which said position information acquisition unit acquired and said estimated feed rate which said feed rate estimation unit calculated when said feed unit is located at a position corresponding to said position information, wherein said processing machine is a plasma processing machine and where said fed energy or material is an arc current, plasma generating current, gas, or welding filler.
 2. A processing information acquisition system as set forth in claim 1, where said feed rate estimation unit has related information, found in advance, between said control command and said estimated feed rate of energy or material and calculates the estimated feed rate from said control command and said related information.
 3. A processing information acquisition system as set forth in claim 2, which is further provided with a feed rate measurement unit which finds said related information in advance.
 4. A processing information acquisition system as set forth in claim 2, where said related information is a calculation formula or parameter or map.
 5. A processing information acquisition system as set forth in claim 1, where said output unit outputs said position information, which said position information acquisition unit acquired, and said estimated feed rate, which said feed rate estimation unit calculated when said feed unit is at a position corresponding to said position information, to a display unit or storage unit. 6-10. (canceled) 